High throughput and small footprint available with a wide range of dicing. Semi-auto dicing machine incorporates image processing-type alignment function.

- High throughput: X axis; 450 mm/s, Y axis; 80 mm/s.
- Wide dicing range: ¯ 240 mm or 240 × 180 mm.
- Small footprint: 800 × 1,170 mm.
- 15-inch color monitor and easy-to-use operation display.
- Compliance with S2-0200 and CE-marking.

High throughput achieved by a new concept

The A-WD-200T uses an opposing, twin spindle arrangement. This unique concept minimizes motion and delivers a massive boost in throughput.

Fully automated dicing machine for 8 inch wafer and large-sized substrates

-Larged-sized Substrates
-High Reliability
-High Processing Quality
-Space Saving

Spindle rotation speed of 80,000 min made possible

The spindle axis comes standard equipped with a newly developed 80,000 min high speed spindle, a result of Tokyo Selmitsu's accumulated expertise in processing technology.

Tokyo Selmitsu is opening up a new domain in processing, with previous unattainable high-speed design dicing and high processing quality (patent pending)

We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting excellent performance.

The ML200 uses multiphoton absorption - the optical damage phenomenon that occurs when the strength of laser light is radically increased - with laser light focused on the inner part of the material to be processed. By doing this an internal modification layer is formed, and this is used as the basic mechanism for separating chips. Put another way, wafers adhering to the dicing tape are irradiated by a laser, and through expansion of the dicing tape, wafer separation is conducted.

High performance laser dicing machine for 300 mm wafers with SDE.

In this system, a modification layer is formed inside the Si wafer through optical damage called multiphoton absorption, and chips are segmented at this point. In ML300, the back surface of the wafers is exposed to Laser light whilst the surface protection tape used for the back-grinding process is left attached.

Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible!
New connected handlers, shorten coordination time - bringing increased operation efficiency and substantial savings in processing time.

Twin Cutting-stage Mechanisms and Independent Microscope Drive Mechanism